SC87C51CCA44
vs
5962-8506401MQX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
|
| JESD-30 Code |
S-PQCC-J44
|
R-GDIP-T40
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
44
|
40
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
QCCJ
|
DIP
|
| Package Equivalence Code |
LDCC44,.7SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
128
|
|
| ROM (words) |
4096
|
|
| ROM Programmability |
UVPROM
|
MROM
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
19 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
3
|
7
|
| Package Description |
|
CERAMIC, DIP-40
|
| Has ADC |
|
NO
|
| Address Bus Width |
|
16
|
| Clock Frequency-Max |
|
12 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
8
|
| Number of I/O Lines |
|
32
|
| PWM Channels |
|
NO
|
| Screening Level |
|
MIL-STD-883
|
| Supply Voltage-Max |
|
6 V
|
| Supply Voltage-Min |
|
4 V
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER
|
|
|
|
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