SC87C51ACN40
vs
TD87C51
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP,
|
DIP-40
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PDIP-T40
|
R-CDIP-T40
|
| Length |
52 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
2
|
| Number of I/O Lines |
32
|
32
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Number of Timers |
2
|
2
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
128
|
|
| ROM (words) |
4096
|
0
|
| ROM Programmability |
OTPROM
|
EPROM
|
| Seated Height-Max |
4.7 mm
|
|
| Speed |
6 MHz
|
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
4 Weeks
|
| CPU Family |
|
MCS-51
|
| RAM (bytes) |
|
256
|
|
|
|
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