SC80C31BACN40 vs 80C31BH/BQA feature comparison

SC80C31BACN40 YAGEO Corporation

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80C31BH/BQA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS ADVANCED MICRO DEVICES INC
Package Description , CERAMIC, DIP-40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-GDIP-T40
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM (words) 0 0
ROM Programmability ROM LESS ROM LESS
Speed 12 MHz 12 MHz
Supply Current-Max 35 mA 20 mA
Supply Voltage-Max 6 V 6 V
Supply Voltage-Min 4 V 4 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 40
ECCN Code 3A001.A.2.C
CPU Family 8051
Format FIXED POINT
Integrated Cache NO
JESD-609 Code e0
Length 52.3875 mm
Low Power Mode YES
Package Code DIP
Package Equivalence Code DIP40,.6
RAM (bytes) 128
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.588 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare SC80C31BACN40 with alternatives

Compare 80C31BH/BQA with alternatives