SC220C0BTAV001
vs
XPC823ZT75B2T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
MOTOROLA INC
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
11
32
Bit Size
32
32
Boundary Scan
NO
YES
Clock Frequency-Max
40 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
Length
27 mm
23 mm
Low Power Mode
NO
YES
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.35 mm
Speed
40 MHz
75 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
3
Part Package Code
BGA
Pin Count
256
Compare SC220C0BTAV001 with alternatives
Compare XPC823ZT75B2T with alternatives