SC16IS750IPW,112 vs 935293393115 feature comparison

SC16IS750IPW,112 NXP Semiconductors

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935293393115 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP2
Package Description 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 HVQCCN,
Pin Count 24
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Additional Feature CAN ALSO OPERATES AT 2.5 V SUPPLY CAN ALSO OPERATES AT 2.5 V SUPPLY
Address Bus Width 2 2
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.625 MBps 0.625 MBps
External Data Bus Width
JESD-30 Code R-PDSO-G24 S-PQCC-N24
JESD-609 Code e4 e4
Length 7.8 mm 4 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Serial I/Os 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 4 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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