SC16C654IB64,151
vs
SC16C654DIB64
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
QFP
Package Description
LFQFP,
QFP, QFP64,.47SQ,20
Pin Count
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width
5
Boundary Scan
NO
Clock Frequency-Max
80 MHz
Communication Protocol
ASYNC, BIT
Data Transfer Rate-Max
0.625 MBps
External Data Bus Width
8
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Length
10 mm
Low Power Mode
YES
Number of Serial I/Os
4
Number of Terminals
64
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max
3.63 V
Supply Voltage-Min
2.97 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
2
Rohs Code
Yes
Moisture Sensitivity Level
1
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
260
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