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SC16C554DBIA68,512 vs SC16C554DBIA68,518 feature comparison

SC16C554DBIA68,512 NXP Semiconductors

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SC16C554DBIA68,518 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LCC LCC
Package Description QCCJ, LDCC68,1.0SQ QCCJ, LDCC68,1.0SQ
Pin Count 68 68
Manufacturer Package Code SOT188-2 SOT188-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5 5
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e3 e3
Length 24.23 mm 24.23 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of Serial I/Os 4 4
Number of Terminals 68 68
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 24.23 mm 24.23 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Samacsys Manufacturer NXP
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

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Compare SC16C554DBIA68,518 with alternatives