SC16C554BIBM,157 vs SC68C94C1N feature comparison

SC16C554BIBM,157 NXP Semiconductors

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SC68C94C1N Philips Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code QFP
Package Description LFQFP, QFP64,.35SQ,16 DIP, DIP48,.6
Pin Count 64
Manufacturer Package Code SOT414-1
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-30 Code S-PQFP-G64 R-PDIP-T48
JESD-609 Code e3 e0
Length 7 mm
Low Power Mode NO
Moisture Sensitivity Level 1
Number of Serial I/Os 4
Number of Terminals 64 48
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP DIP
Package Equivalence Code QFP64,.35SQ,16 DIP48,.6
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.4 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2

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