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SC16C554BIB80 vs SC16C554BIB80,557 feature comparison

SC16C554BIB80 Philips Semiconductors

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SC16C554BIB80,557 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e3
Number of Terminals 80 80
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Equivalence Code QFP80,.55SQ,20 QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Part Package Code QFP
Package Description 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-315-1, LQFP-80
Pin Count 80
Manufacturer Package Code SOT315-1
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol MIL STD 1553A; MIL STD 1553B; STANAG 3838
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
Length 12 mm
Low Power Mode NO
Moisture Sensitivity Level 2
Number of Serial I/Os 4
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

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