SC16C554BIB80,557 vs XR16V654IV80-F feature comparison

SC16C554BIB80,557 NXP Semiconductors

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XR16V654IV80-F MaxLinear Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MAXLINEAR INC
Part Package Code QFP
Package Description 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-315-1, LQFP-80 LFQFP,
Pin Count 80
Manufacturer Package Code SOT315-1
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY @ 50MHZ
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 64 MHz
Communication Protocol MIL STD 1553A; MIL STD 1553B; STANAG 3838 ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps 2 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e3 e3
Length 12 mm 12 mm
Low Power Mode NO YES
Moisture Sensitivity Level 2 3
Number of Serial I/Os 4 4
Number of Terminals 80 80
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2

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