Register or Sign In

SC16C554BIB64 vs SC16C554DBIA68,518 feature comparison

SC16C554BIB64 Philips Semiconductors

Buy Now Datasheet

SC16C554DBIA68,518 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description QFP, QFP64,.47SQ,20 QCCJ, LDCC68,1.0SQ
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-PQFP-G64 S-PQCC-J68
Number of Terminals 64 68
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP64,.47SQ,20 LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Part Package Code LCC
Pin Count 68
Manufacturer Package Code SOT188-2
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-609 Code e3
Length 24.23 mm
Low Power Mode NO
Moisture Sensitivity Level 3
Number of Serial I/Os 4
Peak Reflow Temperature (Cel) 245
Seated Height-Max 4.57 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Width 24.23 mm
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

Compare SC16C554DBIA68,518 with alternatives