SC16C554BIB64 vs SC16C554BIB64,128 feature comparison

SC16C554BIB64 Philips Semiconductors

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SC16C554BIB64,128 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description QFP, QFP64,.47SQ,20 LFQFP, QFP64,.47SQ,20
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Equivalence Code QFP64,.47SQ,20 QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Part Package Code QFP
Pin Count 64
Manufacturer Package Code SOT314-2
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width 8
JESD-609 Code e3
Length 10 mm
Low Power Mode NO
Moisture Sensitivity Level 1
Number of Serial I/Os 4
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Supply Voltage-Max 3.63 V
Supply Voltage-Min 2.97 V
Supply Voltage-Nom 3.3 V
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm

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