SC16C554BIB64,151 vs XR16V554IV-F feature comparison

SC16C554BIB64,151 NXP Semiconductors

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XR16V554IV-F MaxLinear Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS MAXLINEAR INC
Part Package Code QFP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 LFQFP,
Pin Count 64
Manufacturer Package Code SOT314-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP MaxLinear, Inc.
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 64 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps 0.5 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1 3
Number of Serial I/Os 4 4
Number of Terminals 64 64
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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