SC16C550BIBS,151
vs
SC16C550BIA44,529
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFN
LCC
Package Description
HVQCCN, LCC32,.2SQ,20
QCCJ, LDCC44,.7SQ
Pin Count
32
44
Manufacturer Package Code
SOT617-1
SOT187-2
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Additional Feature
ALSO OPERATES AT 2.5V SUPPLY
ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
48 MHz
48 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.375 MBps
0.375 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-N32
S-PQCC-J44
JESD-609 Code
e4
e3
Length
5 mm
16.585 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
1
3
Number of Serial I/Os
1
1
Number of Terminals
32
44
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
QCCJ
Package Equivalence Code
LCC32,.2SQ,20
LDCC44,.7SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
4.57 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin (Sn)
Terminal Form
NO LEAD
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
5 mm
16.585 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
Compare SC16C550BIBS,151 with alternatives
Compare SC16C550BIA44,529 with alternatives