SC16C550BIA44 vs SC16C550BIBS feature comparison

SC16C550BIA44 NXP Semiconductors

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SC16C550BIBS NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LPCC QFN
Package Description PLASTIC, MS-018, SOT-187-2, LCC-44 HVQCCN, LCC32,.2SQ,20
Pin Count 44 32
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 48 MHz 48 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.375 MBps 0.375 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J44 S-PQCC-N32
JESD-609 Code e3 e4
Length 16.585 mm 5 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 1
Number of Serial I/Os 1 1
Number of Terminals 44 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ HVQCCN
Package Equivalence Code LDCC44,.7SQ LCC32,.2SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form J BEND NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16.585 mm 5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 6 6

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