SC16C550BIA44
vs
SC16C550BIBS,128
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
LPCC
QFN
Package Description
PLASTIC, MS-018, SOT-187-2, LCC-44
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-617-1, HVQFN-32
Pin Count
44
32
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
NXP
Additional Feature
ALSO OPERATES AT 2.5V SUPPLY
ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width
3
3
Boundary Scan
NO
NO
Clock Frequency-Max
48 MHz
48 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.375 MBps
0.375 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PQCC-J44
S-PQCC-N32
JESD-609 Code
e3
e4
Length
16.585 mm
5 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
3
1
Number of Serial I/Os
1
1
Number of Terminals
44
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
HVQCCN
Package Equivalence Code
LDCC44,.7SQ
LCC32,.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
J BEND
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16.585 mm
5 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
6
1
Manufacturer Package Code
SOT617-1
Factory Lead Time
16 Weeks
Compare SC16C550BIA44 with alternatives
Compare SC16C550BIBS,128 with alternatives