SC16C2550BIA44 vs SC16C2550BIBS,157 feature comparison

SC16C2550BIA44 NXP Semiconductors

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SC16C2550BIBS,157 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code LPCC QFN
Package Description PLASTIC, MS-018, SOT187-2, LCC-44 HVQCCN, LCC32,.2SQ,20
Pin Count 44 32
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Transfer Rate-Max 5 MBps 5 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J44 S-PQCC-N32
JESD-609 Code e3 e4
Length 16.5862 mm 5 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 1
Number of Serial I/Os 2 2
Number of Terminals 44 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ HVQCCN
Package Equivalence Code LDCC44,.7SQ LCC32,.2SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form J BEND NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16.5862 mm 5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 6 1
Manufacturer Package Code SOT617-1

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