SB860
vs
MS503
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICROSEMI CORP
|
| Package Description |
ROHS COMPLIANT PACKAGE-2
|
O-PALF-W2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
FREE WHEELING DIODE
|
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.7 V
|
0.49 V
|
| JEDEC-95 Code |
DO-201AD
|
DO-201AD
|
| JESD-30 Code |
O-XALF-W2
|
O-PALF-W2
|
| Non-rep Pk Forward Current-Max |
180 A
|
300 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Rep Pk Reverse Voltage-Max |
60 V
|
30 V
|
| Reverse Current-Max |
1000 µA
|
250 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| HTS Code |
|
8541.10.00.80
|
| Output Current-Max |
|
5 A
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SB860 with alternatives
Compare MS503 with alternatives