SB80L186EB-13 vs S80C186XL-25 feature comparison

SB80L186EB-13 Intel Corporation

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S80C186XL-25 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description LFQFP, QFP80,.55SQ,20 QFP,
Pin Count 80 80
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 26 MHz 50 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
JESD-609 Code e0
Length 12 mm 20 mm
Low Power Mode YES YES
Number of DMA Channels 2
Number of External Interrupts 6 5
Number of Serial I/Os 2
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Equivalence Code QFP80,.55SQ,20
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 1.66 mm 3.15 mm
Speed 13 MHz 25 MHz
Supply Current-Max 73 mA 100 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1

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