SB80C188-25 vs TS80C186EB-13 feature comparison

SB80C188-25 Rochester Electronics LLC

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TS80C186EB-13 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTEL CORP
Part Package Code QFP QFP
Package Description TFQFP, QFP,
Pin Count 80 80
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 26 MHz
External Data Bus Width 8 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 R-PQFP-G80
JESD-609 Code e0 e0
Length 12 mm 20 mm
Low Power Mode YES YES
Number of Terminals 80 80
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, THIN PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.15 mm
Speed 25 MHz 13 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD QUAD
Width 12 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os 2
On Chip Data RAM Width
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (words) 0
Supply Current-Max 73 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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