SB80C186EC25 vs TS80C188EC-20 feature comparison

SB80C186EC25 Rochester Electronics LLC

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TS80C188EC-20 Intel Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTEL CORP
Part Package Code QFP QFP
Package Description LFQFP, EIAJ, QFP-100
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 40 MHz
External Data Bus Width 16 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G100 R-PQFP-G100
JESD-609 Code e0
Length 14 mm
Low Power Mode YES YES
Number of Terminals 100 100
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.66 mm
Speed 25 MHz 20 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1
Number of DMA Channels 4
Number of External Interrupts 9
Number of Serial I/Os 2
On Chip Data RAM Width
Peak Reflow Temperature (Cel) NOT SPECIFIED
RAM (words) 0
Supply Current-Max 100 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SB80C186EC25 with alternatives

Compare TS80C188EC-20 with alternatives