SB1660
vs
MBR1660
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
BCD SEMICONDUCTOR MANUFACTURING LTD
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.565 V
|
|
| Non-rep Pk Forward Current-Max |
310 A
|
250 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
175 °C
|
| Output Current-Max |
16 A
|
16 A
|
| Rep Pk Reverse Voltage-Max |
60 V
|
60 V
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Base Number Matches |
5
|
25
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TO-220AC
|
| Package Description |
|
SIMILAR TO TO-220AC, 3 PIN
|
| Pin Count |
|
3
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LOW POWER LOSS
|
| Application |
|
EFFICIENCY
|
| Case Connection |
|
CATHODE
|
| Diode Element Material |
|
SILICON
|
| JESD-30 Code |
|
R-PSFM-T2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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