SB1100
vs
UGF110
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
DIODES INC
|
MICROSEMI CORP
|
| Part Package Code |
DO-41
|
DO-41
|
| Package Description |
PLASTIC PACKAGE-2
|
GLASS HERMETIC DO-41, 2PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
FREE WHEELING DIODE, LOW POWER LOSS
|
|
| Application |
GENERAL PURPOSE
|
|
| Breakdown Voltage-Min |
100 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.79 V
|
|
| JEDEC-95 Code |
DO-41
|
|
| JESD-30 Code |
O-PALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
40 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Current-Max |
20 µA
|
|
| Reverse Test Voltage |
100 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
6
|
1
|
| Reverse Recovery Time-Max |
|
0.03 µs
|
|
|
|
Compare SB1100 with alternatives
Compare UGF110 with alternatives