SAML10E16A-UU
vs
SAML10E16A-AU
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
WLCSP-32
|
TQFP-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-02-15
|
2019-02-15
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PBGA-B32
|
S-PQFP-G32
|
| Length |
2.79 mm
|
7 mm
|
| Number of I/O Lines |
25
|
25
|
| Number of Terminals |
32
|
32
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
0.482 mm
|
1.2 mm
|
| Speed |
32 MHz
|
32 MHz
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
1.62 V
|
1.62 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
2.79 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
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