SAK-XC2298H-200F100LAB
vs
XC2299H200F100LABKXUMA1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
INFINEON TECHNOLOGIES AG
|
Package Description |
0.50 MM PITCH, GREEN, PLASTIC, LQFP-176
|
HLFQFP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G176
|
S-PQFP-G176
|
JESD-609 Code |
e3
|
e3
|
Length |
24 mm
|
24 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of I/O Lines |
147
|
147
|
Number of Terminals |
176
|
176
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HLFQFP
|
HLFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
100 MHz
|
100 MHz
|
Supply Voltage-Max |
1.6 V
|
1.6 V
|
Supply Voltage-Min |
1.4 V
|
1.4 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24 mm
|
24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Infineon
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SAK-XC2298H-200F100LAB with alternatives
Compare XC2299H200F100LABKXUMA1 with alternatives