SAB80C52-16-P
vs
87C52/BQA
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
SIEMENS A G
|
QP SEMICONDUCTOR INC
|
Package Description |
,
|
WDIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
16 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PDIP-T40
|
R-GDIP-T40
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
|
|
Number of External Interrupts |
2
|
|
Number of I/O Lines |
32
|
32
|
Number of Serial I/Os |
1
|
|
Number of Terminals |
40
|
40
|
Number of Timers |
3
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
WDIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE, WINDOW
|
Qualification Status |
Not Qualified
|
|
RAM (words) |
256
|
|
ROM (words) |
8192
|
|
ROM Programmability |
MROM
|
OTPROM
|
Speed |
16 MHz
|
|
Supply Current-Max |
26 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
4
|
Part Package Code |
|
DIP
|
Pin Count |
|
40
|
ECCN Code |
|
3A001.A.2.C
|
Seated Height-Max |
|
5.715 mm
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
15.24 mm
|
|
|
|
Compare SAB80C52-16-P with alternatives
Compare 87C52/BQA with alternatives