SAB8052B-16-P
vs
LD87C51BH
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SIEMENS A G
INTEL CORP
Package Description
,
WDIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Additional Feature
POWER-DOWN PIN VPD 4.5 - 5.5V; BOOLEAN PROCESSOR
BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
12 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-PDIP-T40
R-GDIP-T40
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of I/O Lines
32
32
Number of Serial I/Os
1
Number of Terminals
40
40
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Qualification Status
Not Qualified
Not Qualified
RAM (words)
256
ROM (words)
8192
4096
ROM Programmability
MROM
UVPROM
Speed
16 MHz
12 MHz
Supply Current-Max
175 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
40
Length
52.325 mm
Seated Height-Max
5.72 mm
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare SAB8052B-16-P with alternatives
Compare LD87C51BH with alternatives