SAB80188-1-N
vs
TS68000ME8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
SIEMENS A G
THOMSON COMPONENTS-MOSTEK CORP
Package Description
,
QCCN, LCC68,.95SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS
Address Bus Width
20
Bit Size
16
32
Boundary Scan
NO
Clock Frequency-Max
20 MHz
External Data Bus Width
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQCC-J68
S-CQCC-N68
Low Power Mode
NO
Number of DMA Channels
2
Number of External Interrupts
5
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
QCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Speed
10 MHz
8 MHz
Supply Current-Max
550 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
NMOS
MOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
J BEND
NO LEAD
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
4
Rohs Code
ECCN Code
3A001.A.2.C
JESD-609 Code
e0
Package Equivalence Code
LCC68,.95SQ
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
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