SAB80186-N
vs
MC68HC000FN10
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SIEMENS A G
|
MOTOROLA INC
|
| Package Description |
,
|
QCCJ, LDCC68,1.0SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS
|
|
| Address Bus Width |
20
|
23
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
10 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
| Low Power Mode |
NO
|
NO
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
5
|
7
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Speed |
8 MHz
|
10 MHz
|
| Supply Current-Max |
550 mA
|
30 mA
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
NMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
3
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
68
|
| JESD-609 Code |
|
e0
|
| Length |
|
24.2062 mm
|
| Package Code |
|
QCCJ
|
| Package Equivalence Code |
|
LDCC68,1.0SQ
|
| Seated Height-Max |
|
4.57 mm
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
24.2062 mm
|
|
|
|
Compare SAB80186-N with alternatives
Compare MC68HC000FN10 with alternatives