SAB3037N vs TDA5637MDK-T feature comparison

SAB3037N Philips Semiconductors

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TDA5637MDK-T NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP24,.6 SSOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T24 R-PDSO-G24
JESD-609 Code e0
Number of Terminals 24 24
Operating Temperature-Max 70 °C 80 °C
Operating Temperature-Min -20 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
ECCN Code EAR99
Built-in IF Amplifier YES
Consumer IC Type VIDEO TUNER
Input Frequency-Max (RF) 860 MHz
Input Frequency-Min (RF) 45 MHz
Length 8.2 mm
Noise Figure-Nom 8 dB
Number of Bands 3
Seated Height-Max 2 mm
Supply Current-Max 50.5 mA
Supply Voltage-Max (Vsup) 9.9 V
Supply Voltage-Min (Vsup) 8.1 V
Width 5.3 mm

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