SAB-C501G-1RP vs TS80C32X2-MIA feature comparison

SAB-C501G-1RP Infineon Technologies AG

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TS80C32X2-MIA Temic Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description PLASTIC, DIP-40 PLASTIC, DIP-40
Pin Count 40
Reach Compliance Code not_compliant unknown
HTS Code 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
CPU Family 8051
Clock Frequency-Max 12 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0
Length 52.3 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256
ROM (words) 8192
ROM Programmability MROM
Seated Height-Max 4.83 mm
Speed 12 MHz 40 MHz
Supply Current-Max 21 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2

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