SAA3008PN
vs
M708B1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Package Description |
DIP,
|
PLASTIC, DIP-20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
TRANSMITTER IC
|
TRANSMITTER IC
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
| Length |
26.73 mm
|
25.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
6.5 V
|
10.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmission Media |
INFRARED
|
INFRARED
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
20
|
| JESD-609 Code |
|
e0
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SAA3008PN with alternatives
Compare M708B1 with alternatives