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SA612AD/01,112 vs SA636DK/01,118 feature comparison

SA612AD/01,112 NXP Semiconductors

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SA636DK/01,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SSOP2
Package Description SSOP-8 SSOP-20
Pin Count 8 20
Manufacturer Package Code SOT96-1 SOT266-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP NXP
JESD-30 Code R-PDSO-G8 R-PDSO-G20
JESD-609 Code e4 e4
Length 4.9 mm 6.5 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.5 mm
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 4.4 mm
Base Number Matches 1 1
Package Equivalence Code SSOP20,.25
Telecommunication Circuits » Other Telecom ICs
Telecommunication Circuits » Other Telecom ICs

Compare SA612AD/01,112 with alternatives

Compare SA636DK/01,118 with alternatives