SA612AD/01,112
vs
AD73311ARSZ-REEL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ANALOG DEVICES INC
|
| Part Package Code |
SOIC
|
SSOP
|
| Package Description |
SSOP-8
|
SSOP-20
|
| Pin Count |
8
|
20
|
| Manufacturer Package Code |
SOT96-1
|
RS-20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
Analog Devices
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.9 mm
|
7.2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
3.9 mm
|
5.3 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
EAR99
|
| Filter |
|
YES
|
| Gain Tolerance-Max |
|
1 dB
|
| Linear Coding |
|
16-BIT
|
| Package Equivalence Code |
|
SSOP20,.3
|
| Technology |
|
CMOS
|
|
|
|
Compare SA612AD/01,112 with alternatives
Compare AD73311ARSZ-REEL with alternatives