SA606DK-T vs CXA3174N feature comparison

SA606DK-T NXP Semiconductors

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CXA3174N Sony Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SONY CORP
Package Description LSSOP, LSSOP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 6.5 mm 6.5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 80 °C
Operating Temperature-Min -40 °C -35 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.45 mm
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Part Package Code SSOP
Pin Count 20
Technology BIPOLAR

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