SA606DK/03
vs
935051630602
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
LSSOP,
7.50 MM, PLASTIC, SOT-163-1, MS-013AC, SOL-20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
6.5 mm
12.8 mm
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Seated Height-Max
1.5 mm
2.65 mm
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
7.5 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
SOIC
Pin Count
20
JESD-609 Code
e4
Qualification Status
Not Qualified
Terminal Finish
NICKEL PALLADIUM GOLD
Compare SA606DK/03 with alternatives
Compare 935051630602 with alternatives