Findchips: Compare SA606DK/03,118 vs CXA3174N

SA606DK/03,118 vs CXA3174N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	SONY CORP
Package Description	4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20	LSSOP,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	R-PDSO-G20	R-PDSO-G20
Length	6.5 mm	6.5 mm
Number of Functions	1	1
Number of Terminals	20	20
Operating Temperature-Max	85 °C	80 °C
Operating Temperature-Min	-40 °C	-35 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LSSOP	LSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Seated Height-Max	1.5 mm	1.45 mm
Supply Voltage-Nom	3 V	3 V
Surface Mount	YES	YES
Telecom IC Type	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature Grade	INDUSTRIAL	COMMERCIAL EXTENDED
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	4.4 mm
Base Number Matches	1	1
Part Package Code		SSOP
Pin Count		20
Qualification Status		Not Qualified
Technology		BIPOLAR
	Telecommunication Circuits » Other Telecom ICs	Telecommunication Circuits » Other Telecom ICs