SA58641DK,112
vs
BU8242F-DX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROHM CO LTD
|
Part Package Code |
SSOP2
|
SOIC
|
Package Description |
LSSOP,
|
SOP,
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
SOT266-1
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e4
|
|
Length |
6.5 mm
|
12.5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
2.01 mm
|
Supply Current-Max |
8.5 mA
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
5.4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare SA58641DK,112 with alternatives
Compare BU8242F-DX with alternatives