SA58640DK,112
vs
UPC8125GR-E1
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
SSOP2
|
|
| Package Description |
LSSOP,
|
SSOP-20
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
SOT266-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
R-PDSO-G20
|
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LSSOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Current-Max |
6 mA
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SA58640DK,112 with alternatives
Compare UPC8125GR-E1 with alternatives