SA58640DK,112
vs
UPC8002GR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEC ELECTRONICS CORP
Part Package Code
SSOP2
SSOP
Package Description
LSSOP,
LSSOP,
Pin Count
20
20
Manufacturer Package Code
SOT266-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e0
Length
6.5 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.45 mm
Supply Current-Max
6 mA
2.2 mA
Supply Voltage-Nom
5 V
3 V
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
4.4 mm
Base Number Matches
1
3
Technology
BIPOLAR
Compare SA58640DK,112 with alternatives
Compare UPC8002GR with alternatives