SA556N vs SE556-1F feature comparison

SA556N STMicroelectronics

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SE556-1F NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature IT CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
Analog IC - Other Type PULSE; RECTANGULAR
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e3 e0
Number of Functions 2
Number of Terminals 14 14
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 4

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Compare SE556-1F with alternatives