SA556-1F vs NE556JR feature comparison

SA556-1F Philips Semiconductors

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NE556JR Texas Instruments

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-GDIP-T14
JESD-609 Code e0
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 14
Analog IC - Other Type PULSE; RECTANGULAR
Length 19.56 mm
Number of Functions 2
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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