SA556-1F vs KA556I feature comparison

SA556-1F Philips Semiconductors

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KA556I Fairchild Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Package Description DIP, DIP14,.3 DIP-14
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0 e3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code DIP
Pin Count 14
Additional Feature CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY
Analog IC - Other Type PULSE; RECTANGULAR
Length 19.4 mm
Number of Functions 2
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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