SA555N
vs
LMC555CN/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
Reach Compliance Code
unknown
compliant
Analog IC - Other Type
SQUARE
PULSE; RECTANGULAR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
Length
9.5 mm
9.817 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
5.08 mm
Supply Voltage-Max (Vsup)
16 V
12 V
Supply Voltage-Min (Vsup)
4.5 V
1.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
2
Rohs Code
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-609 Code
e3
Moisture Sensitivity Level
1
Output Frequency-Max
3 MHz
Peak Reflow Temperature (Cel)
260
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
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