SA555 vs SE555N feature comparison

SA555 Fairchild Semiconductor Corporation

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SE555N NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP-8 0.300 INCH, PLASTIC, DIP-8
Pin Count 8 14
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE AT 15V NOMINAL SUPPLY
Analog IC - Other Type PULSE; RECTANGULAR SQUARE
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 9.2 mm 9.5 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
Samacsys Manufacturer NXP

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