SA5534AN vs RM5534AD feature comparison

SA5534AN NXP Semiconductors

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RM5534AD Raytheon Semiconductor

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RAYTHEON SEMICONDUCTOR
Part Package Code DIP
Package Description PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 2 µA 0.8 µA
Bias Current-Max (IIB) @25C 1.5 µA 0.8 µA
Common-mode Reject Ratio-Nom 100 dB 100 dB
Frequency Compensation YES (AVCL>=3) YES (AVCL>=3)
Input Offset Voltage-Max 5000 µV 2000 µV
JESD-30 Code R-PDIP-T8 R-GDIP-T8
Length 9.5 mm
Low-Offset NO NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -22 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.08 mm
Slew Rate-Nom 13 V/us 13 V/us
Supply Current-Max 10 mA 6.5 mA
Supply Voltage Limit-Max 22 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 10000 10000
Voltage Gain-Min 15000 50000
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Common-mode Reject Ratio-Min 80 dB
JESD-609 Code e0
Terminal Finish TIN LEAD

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