SA5.0C
vs
TGL41-6.8C
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
FIRST COMPONENTS INTERNATIONAL
|
EIC SEMICONDUCTOR CO LTD
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Clamping Voltage-Max |
9.6 V
|
10.8 V
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| Polarity |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Rep Pk Reverse Voltage-Max |
5 V
|
5.5 V
|
| Surface Mount |
NO
|
YES
|
| Base Number Matches |
42
|
7
|
| Rohs Code |
|
Yes
|
| Package Description |
|
MELF-2
|
| Additional Feature |
|
EXCELLENT CLAMPING CAPABILITY
|
| Breakdown Voltage-Max |
|
7.48 V
|
| Breakdown Voltage-Min |
|
6.12 V
|
| Breakdown Voltage-Nom |
|
6.8 V
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
DO-213AB
|
| JESD-30 Code |
|
O-PELF-R2
|
| Non-rep Peak Rev Power Dis-Max |
|
400 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Power Dissipation-Max |
|
1 W
|
| Reverse Current-Max |
|
1000 µA
|
| Reverse Test Voltage |
|
5.5 V
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
|
|
|