SA110-B
vs
P6KE130CE3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| JESD-609 Code |
e0
|
e3
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
3
|
26
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
O-PALF-W2
|
| Pin Count |
|
2
|
| Breakdown Voltage-Max |
|
143 V
|
| Breakdown Voltage-Min |
|
117 V
|
| Breakdown Voltage-Nom |
|
130 V
|
| Case Connection |
|
ISOLATED
|
| Clamping Voltage-Max |
|
187 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
|
O-PALF-W2
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
600 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Polarity |
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
|
5 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
IEC-61000-4-2, 4-4, 4-5
|
| Rep Pk Reverse Voltage-Max |
|
105 V
|
| Surface Mount |
|
NO
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
WIRE
|
| Terminal Position |
|
AXIAL
|
|
|
|
Compare SA110-B with alternatives
Compare P6KE130CE3 with alternatives