S9S08SH8E2MPJR
vs
S9S08SH8E2CTGR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
TSSOP
|
| Package Description |
DIP,
|
TSSOP, TSSOP16,.25
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G16
|
| Length |
24.69 mm
|
5 mm
|
| Number of I/O Lines |
18
|
14
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
5.08 mm
|
1.2 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| RAM (bytes) |
|
512
|
| ROM (words) |
|
8192
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare S9S08SH8E2MPJR with alternatives
Compare S9S08SH8E2CTGR with alternatives