S9S08SG8E2MTG
vs
S9S08SG8E2VTG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
ROHS COMPLIANT, TSSOP-16
ROHS COMPLIANT, TSSOP-16
Pin Count
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e3
Length
5 mm
5 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
12
12
Number of Terminals
16
16
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP16,.25
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
512
512
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.2 mm
1.2 mm
Speed
40 MHz
40 MHz
Supply Current-Max
120 mA
120 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
4.4 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
2
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
Compare S9S08SG8E2MTG with alternatives
Compare S9S08SG8E2VTG with alternatives